C4f8 plasma polymerization pdf

Plasma polymerization takes place in a low pressure and low temperature plasma that is produced by a glow discharge through an organic gas or vapor. Poh, yee cheong lam and mary beeeng chanpark download pdf 664 kb. Request pdf solid particle production in fluorocarbon plasmas ii. The thermal stability of ppfc film was improved with substrate temperature. The plasma copolymerization of ethylene et and tetrafluoroethylene tfe was investigated by means of ir and xps analyses. Pulsed plasma polymerization of benzaldehyde for retention. Plasma polymerization of acrylic acid onto polystyrene by cyclonic plasma at atmospheric pressure yijan chang, chinho lin, and chun huang department of chemical engineering and materials science, yuan ze university, chungli 32003, taiwan. These measurements showed that the amount of light fluorocarbon radicals and ions increased with increasing electron. Another approach is to use chemical dry etching cde of si3n4 with mixtures rich in o2n2 1. Plasma polymerization and surface treatment of polymers f.

The chain polymerization process occurs with the assistance of plasma energy during plasma polymerization and this plasma energy is used to activate electrons, ions and radicals. Polymerization yields finely divided, stable latexes and dispersions to be used directly in coatings, paints, and adhesives. Plasma chemistry and reaction mechanism for modeling of arcc4f8o2 discharges. The microporous composite membranes with a hydrophilic layer sandwiched between two. Deposition of thin films by plasma polymerization for. Therefore, it is necessary to enhance the plasma energy to synthesize highdensity conductive polymer nanoparticles with singlecrystallinity as the active layers for gas sensors on various substrates at room temperature. Film properties are determined using fourier transform infrared ftir. Durham etheses an investigation of plasma polymerization. Under certain process conditions, plasma polymerization of fluorocarbons on structured silicon samples shows two distinctive effects. They observed static water contact angle swca is higher for c2f6 and 399 c3f8 polymer coatings by pw plasma polymerization, but swca of c4f8 plasma polymer coating is 400 higher for cw plasma polymerization as shown in tab.

The effects of hmdso plasma polymerization on physical, lowstress mechanical and surface properties of wool fabrics fabio rombaldoni, raffaella mossotti, alessio montarsolo, roberto demichelis, riccardo innocenti, giorgio mazzuchetti consiglio nazionale delle ricerche istituto per lo studio delle macromolecole. Read plasma polymerization of octafluorocyclobutane and hydrophobic microporous composite membranes for membrane distillation, journal of applied polymer science on deepdyve, the largest online rental service for scholarly research with thousands of academic publications available at your fingertips. Plasma polymerization depends on monomer flow rate, system pressure and discharge power among other variable parameters such as the geometry of the system, the reactivity of the starting mono. Plasma rie etching birck nanotechnology center fundamentals and applicationsfundamentals and applications 1. Solid particle production in fluorocarbon plasmas ii. Different process parameters for plasma polymerization e. Nanoscale selective area atomic layer deposition of tio2. Pulsed plasma polymerization of benzaldehyde for retention of. Polymers formed from this technique are generally highly branched and highly crosslinked, and adhere to solid surfaces well.

To investigate the mechanism of c4f8 dissociation in parallelplatetype plasma, we used several of the latest diagnostic tools and made extensive measurements of electrons, radicals, and ions under conditions that greatly suppressed the effects of plasma surface interaction. A new straightforward protocol for the fabrication of. Evaluating the performance of cc4f8, cc5f8, and c4f6 for. Exploration of plasmaenhanced chemical vapor deposition as a method for thinfilm fabrication with biological applications milana c.

The source is operated with argon as working gas at a flow rate of 6 slm and 10100 sccm admixtures of the respective monomer. The complete surface kinetics model was previously developed, incorporated, and tested for accuracy within the simulator as reported in the companion paper guo et al. Deposition and composition of polymer films in fluorocarbon. Plasma surface modification and plasma polymerization crc. Whether youve loved the book or not, if you give your honest and detailed thoughts then people will find new books that are right for them. Plasma polymerization of acrylic acid onto polystyrene by. Jun 30, 2015 a hybrid model is used to investigate the fragmentation of c 4 f 8 inductive discharges. Perfluoroisobutylenes production and use as a synthetic intermediate for the production of polymeric materials1 and use in the etching process for seimiconductors2 may result in its release to the environment through various waste streamssrc.

The effects of pulse peak power, pulseon time, duty cycle, and monomer pressure on film composition, especially aldehyde functional groups, and surface polarity are examined. Cannot be used for polymers whose glass transition temperature is less than the polymerization temperature, or else aggregation will occur. Radical kinetics for polymer film deposition in fluorocarbon c4f8, c3f6 and c5f8 plasmas by k takahashi, a itoh, t nakamura and k tachibana no static citation data no static citation data cite. This gas has become available on an industrial scale only recently and we felt the need to increase the data in our possession on its behavior both in the plasma chamber and in the gas delivery systems. Vasenkova university of illinois, department of electrical and computer engineering, 1406 west green street. This book provides a basic and thorough presentation of.

Tutorial on plasma polymerization deposition of functionalized films mawson institute. Polymerization of fluorocarbons in reactive ion etching. Plasma and surface properties for icps sustained in cc4f8 oar in this section, results from our parametric investigation of plasma properties of icps sustained in ar, o2, and c4f8 ar mixtures with and without static magnetic. Investigation of surface polymerization on silicon exposed to. In the plasma polymerization process, a monomer gas is pumped into a vacuum chamber where it is polymerized by a plasma to form a thin, clear coating. Plasma polymerization and its applications in textiles. This paper shows the systematic study on the property of plasma polymerized fluorocarbon ppfc film formed by a capacitive couplingtype plasma polymerization equipment using a mixture of ch 4 c 4 f 8 gas. Surface modification of carbon nanofibers and graphene. To investigate the mechanism of c 4 f 8 dissociation in parallelplatetype plasma, we used several of the latest diagnostic tools and made extensive measurements of electrons, radicals, and ions under conditions that greatly suppressed the effects of plasma surface interaction.

Mechanism of c4f8 dissociation in parallelplatetype plasma. Gallen, switzerland plasma polymerization enables the deposition of thin coatings on all kinds of substrates using electrical monomer discharges. In these plasmas polymerization occurs readily and molecules containing up to ten carbon atoms the mass limit of the mass spectrometer. Response surface method is employed to provide insights on how changes in coil power, passivating time and gas flow conditions affect plasma polymerization of csubscript 4fsubscript 8. Plasma polymerization occurs at both low pressure and atmospheric pressure. Cfcf n and cf2 groups were greatly reduced in intensity in the copolymer. A simple plasma polymerization method was used for the preparation of smart copolymer coatings with tunable and reversiblyswitchable wetting properties in various ph environments. Request pdf irregular film thickness distribution in c4f8 inductively coupled plasma polymer deposition under certain process conditions, plasma polymerization of fluorocarbons on structured. This selectivity is due to the deposition of a polymer layer, which is then consumed.

Jun 01, 2003 it is able to combine very high performance with a benign environmental effect. Bulk plasma fragmentation in a c4f8 inductively coupled. Plasma chemistry and reaction mechanism for modeling of arocc4f8oo2 discharges alex v. Plasma polymerization of octafluorocyclobutane and. Elemental composition of plasma polymers from c4f8, chf 3 and. Westwood found that the structure of plasma polymers is more regularly and defined in the sense of classic polymers the lower the power input to the plasma a. Request pdf fluorocarbonbased plasma etching of sio2. Plasma polymerization of c4f8 passivation layer deposited on silicon was necessary to allow for ease of demolding pdms. Plasma polymerization or glow discharge polymerization uses plasma sources to generate a gas discharge that provides energy to activate or fragment gaseous or liquid monomer, often containing a vinyl group, in order to initiate polymerization. Fluorocarbon plasma etching is still the foremost process for obtaining. Exploration of plasmaenhanced chemical vapor deposition as a.

Effects of ar and o2 additives on sio2 etching in c4f8based. Pulsed plasma polymerization of benzaldehyde is used to produce thin films containing aldehyde functional groups. It is converted to a gas in an evaporator and is pumped into the vacuum chamber. First, the growth rate at a certain depth inside the trenches is considerably larger than at the shoulders, the trench bottom or other areas of the sidewall. Greater chemical selectivity and faster deposition rates are found for monomers containing. Tunable surface chemistry and wettability of octafluorocyclobutane and acrylic acid copolymer combined ldpe substrate by pulsed plasma polymerization. Bulk plasma fragmentation in a c 4f 8 inductively coupled plasma.

Tunable wettability and phresponsiveness of plasma. Plasma functionalization of foiles and technical textiles with specific tunable wetting behavior m. Plasma deposition of fluorocarbon thin films from cc4f8 using pulsed. Peel force and demolding status are used to determine if delamination is successful. A plasma is a highly reactive gas which contains neutral, excited and ionized.

It is able to combine very high performance with a benign environmental effect. Membrane surface modification by plasma polymerization of ethylenediamine for fractination of saccharides haci ali gulec1, arzu topacli 2, cafer topacli, yasin sen3, nedim albayrak1, mehmet mutlu3 1 department of food engineering, yuzuncu yil university, 65080 van, turkey. Controlled surface wettability by plasma polymer surface. Polymer formation in plasma polymerization conventional, molecular plasma polymerization, atomic competitive ablation and polymerization cap plasma sensitivity of elements dc discharge polymerization field effects influence of wall contamination. Plasma polymer films world scientific publishing company. The densities of large polymers increase with increasing size of the parent gas. In chaingrowth or chain polymerization, the only chainextension reaction step is the addition of a monomer to a growing chain with an active center such as a free radical or ion. Plasma polymer films examines the current status of the deposition and characterization of fluorocarbon, hydrocarbon and siliconcontaining plasma polymer films and nanocomposites, with plasma polymer matrix. A study 12 described a combination of plasma and photolithographic processes for production of microstructured surfaces. The effect of pressure, inductively coupled plasma power, temperature, flow rate, and bias power on both deposition rate and film composition has been explored over a relatively wide range. Abstract hexafluoro1,3butadiene c 4 f 6 is a relatively new etch gas for the manufacturing of semiconductor devices, especially in critical etch processes that need high aspect ratios and selectivity. To better understand the performance differences between c c4f8, c4f6, and cc5f8, we performed a number of characterization studies to learn more about how these molecules. Comparison of c4f6ar and c4f8 ar discharges a gas phase and surface chemistry study of. Polymethylmethacrylate pmma, polyvinylpyrrolidone pvp, and octafluorocyclobutane c4f8 were the polymeric materials studied where pmma and pvp were deposited using spin coating and c4f8 was grown using inductively coupled plasma icp polymerization.

To investigate the mechanism of c4f8 dissociation in parallelplatetype plasma, we used several of the latest diagnostic tools and made extensive measurements of electrons, radicals, and ions unde. If the adhesion forces between the silicone rubber and the wafer were too high, the silicone rubber would be stuck in the trenches of the wafer and the mold would be rendered useless for subsequent usage. Knes 4 1 fraunhofer institute for interfacial engineering and biotechnology, nobelstr. Investigation of surface properties of fluorocarbon films. In a first step, a layer which is nonadhesive towards cells and proteins was obtained by pulsed plasma polymerization of diethylene glycol dimethyl ether monomer ppeolike. Figure 5 summarizes the results of this study, and an evaluation of the chemical composition of the polymer film by xray photoelectron spectroscopy xps. Optical emission analysis of cf4chf3ar plasma etch of oxide.

Plasma polymerization of csubscript 4fsubscript 8 thin. Conductive polymer synthesis with singlecrystallinity via. This paper shows the systematic study on the property of plasmapolymerized fluorocarbon ppfc film formed by a capacitive couplingtype plasma polymerization equipment using a mixture of ch 4 c 4 f 8 gas. Indeed, the resulting reactive species are crucial for the optimization of the sibased etching process, since they determine the mechanisms of fluorination, polymerization, and sputtering. In this regard, styrene monomer is often preferred in the case of plasma polymerization because of its high organic character as well as high vapor pressure.

Plasmapolymerization of hmdso using an atmospheric. Fabrication of hydrophobic films from ofcb monomer by plasma. Plasma functionalization of foiles and technical textiles. Plasma copolymerization of ethylene and tetrafluoroethylene. Polymerization of fluorocarbons in reactive ion etching plasmas. Styrene is very important from the technological point of view and is widely investigated 47. Publishers pdf, also known as version of record includes final page. Gas phase reactions for polymerization solid particles were observed in fluorocarbon c4f8 plasmas applied to semiconductor.

Pdf controlled surface wettability by plasma polymer 2. Atmospheric pressure plasma polymerization using double. Film properties are determined using fourier transform infrared ftir spectroscopy, xray photoelectron. Plasma polymerization and surface treatment of polymers. In this paper, hydrophilic microporous cellulose nitrate membranes have been surface.

Plasma deposition of fluorocarbon thin films from cc4f8 using. Property of plasmapolymerized fluorocarbon film in. Perfluoroisobutylene is generated during the thermal decomposition of polytetrafluoroethylene4. Discussion on plasma polymerization mechanism in 1971, a. It introduces plasma polymerization process diagnostics such as optical emission spectroscopy oes, aoes, and describes special. General trend in the evolution of rie chemistries for anisotropic etching of sio2.

A hybrid modeling study shuxia zhao,1,2 yuru zhang,1,2 fei gao,1 younian wang,1 and annemie bogaerts2 1school of physics and optoelectronic engineering, dalian university of technology, dalian 116024. The widerange and tunable wetting properties by coordination of composition, functionality, and morphology using straightforward protocol open up a potential door. Plasma polymerization of c4f8 thin film on high aspect ratio silicon molds by l. For radicaldominated discharges the reaction parameter power input per gas flow. Plasma polymerization of c4f8 thin film on high aspect ratio. Plasma polymerization aims to bridge the conceptual gap between the academic and practical approaches to plasma polymerization and highlights the significance of plasma polymerization in materials science and technology. Plasma deposition, treatment, and etching of polymers, edited by r. The plasma polymerization of two fluorocarbon compounds octafluorocyclobutane c. This gas has become available on an industrial scale only recently and. Note that use of h2 in a plasma containing cl2 or bcl3 can. The passivation step used in the bosch process alternating etching and deposition steps to perform deep anisotropic silicon etching has been examined in detail. Plasma polymerization of c4f8 thin film on high aspect. In contrast to rie, the synergistic effect of ion bombardment, which is. Memsii lecture 3 dry etching ii university of florida.

On the other hand the low plasma power induced the inclusion of. The cw and pw plasma polymerization mechanism difference is following figure. Once the growth of a chain is initiated by formation of an active center, chain propagation is usually rapid by addition of a sequence of monomers. In this articlc surfacc trcatmcnt of polymcrs by both surfacc modification and plasma. Pulsed plasma polymerization of precursors containing long perfluoroalkyl chains can lead to the formation of structurally welldefined low surface energy films. Synthesis and characterization of plasma polymerized. Curie university enscp 11 rue picrre ct maric curie 7523 1 paris cedex 05 abstract. On the importance of ions and ionmolecule reactions to plasma surface interface reactions, journal of the american society for mass spectrometry, 2002, pp. Therefore, the control of characteristics of the formed polymer layers, which is a main factor in obtaining high selectivity to.

The binding energy of the cfcf n pea k indicated that the component peak was, in fact, due to cfcf. However, the use of high density plasma sources with high cf ratio gas compositions often generates a thick polymer layer and physical damage on the exposed silicon surface during the overetch period. The effect of the o2ar mixing ratio in cf4o2ar and c4f8 o2ar inductively coupled plasmas with a 50% fluorocarbon gas content on plasma parameters and active species densities, which influence. The deposition rates for plasma ettfe copolymers, when plotted versus mol %. Irregular film thickness distribution in c4f8 inductively. Ar plasma etching was simulated using a threedimensional monte carlo profile simulator. Octafluorocyclobutane, or perfluorocyclobutane, c4f8, is a compound of carbon and fluorine used in the production and processing of semiconductor materials and devices, for example as a deposition gas and etchant. Other readers will always be interested in your opinion of the books youve read. The polymer along the trench bottom must be sufficiently fluorinated, and there must be an adequate supply of cf2 ions and radicals within the plasma to promote. Investigation of fluorocarbon plasma deposition from c. The property of plasmapolymerized fluorocarbon film in. On the importance of ions and ionmolecule reactions to. Optical emission analysis of cf 4 chf 3 ar plasma etch of oxide anjali walia irvington high school 815 1.

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